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Rigid-Flex PCB(Rigid-Flex printed circuit board)is a printed circuit board that combines rigid PCB and flexible PCB, which does not require connectors, and can form interlayer conduction through PTH.
Use rigid FR-4 as the rigid substrate for the rigid-flex PCB outer board, and spray solder mask ink to protect the circuit pattern on rigid PCB parts. Flexible PCB parts use PI film as a flexible core board and cover polyimide or acrylic film. Adhesives use low-flow prepregs, and finally these substrates are laminated together to make rigid-flex PCBs.
Our flex and rigid-flex are available for single or double sided circuits as well as higher technology multilayer designs up to 20 layers. Our flex and rigid-flex PCBs are manufactured for a variety of applications in the medical, military, aerospace and portable device industries.
This is Multi-stackup, that is, at different positions on the substrate, its thickness and stacked structure are different, as shown in 6 layer rigid-flex circuit board stackup below. The thicker stackup is usually applied to the rigid substrate portion, while the stackup on the flexible circuit portion will be thinner and suitable for bending and folding.
With the bending and folding capabilities of rigid-flex boards in tight spaces, Rigid-flex printed circuit boards are widely used in military and avionics manufacturing. When designing a rigid-flex board, expand the minimum ring hole on the flexible layer plated via hole, and ensure that all line-to-pad and line-to-trace nodes added the teardrops to meet the multi-layer Rigid-flex circuit technology. Beton Technology can manufacture multilayer Rigid-flex circuit board and HDI Rigid-flex circuit board.
Rigid-flex circuits support connecting external blind via PCB layers to one or more inner layers without passing through the entire board; buried vias connect one or more inner layers without passing through the outer layers. Rigid-flex PCBs require a lower number of interconnects and related components. It helps simplify assembly operations, making rigid-flex PCBs easier to assemble and test. Rigid-flex PCB is very suitable for PCB prototyping.
1. Small size, flexible shape, the compact shape of the rigid-flex PCB makes it the best choice for thin lines and high-density circuits in HDI technology.
2. Can be customized for different applications, can be customized for applications in many industries such as aerospace, military, medical equipment and consumer electronics.
3. Better mechanical stability, the stability of the rigid board and the flexibility of the flexible board form a stable structure for the entire package
4. Better performance in harsh environments, rigid-flex PCBs have high resistance to shock and high vibration, so they can work normally in high-stress environments.
5. Ease of fabrication and testing
6. High circuit density, good heat dissipation and chemical resistance
Item |
Capabilities |
Rigid-Flex PCB Layer |
2-30 layers |
Base Material |
PI (12.5um, 25um, 50um, 75um,100um), FR4 TG 130, 150, 170, 180 (0.05mm-3.2mm) |
Stiffeners Material |
PI, FR4, stainless steel, aluminum |
EMI Shielding Film |
HCF-6000G,PC800 |
Board Thickness |
0.4mm ~ 6.0mm |
Copper Thickness |
HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ |
Solder Mask Color |
Green, White, Black, Red, Blue, Yellow |
Coverlay Color |
Black, White, Amber, Yellow |
Surface Finish |
HASL, ENIG, Immersion Nickel Palladium Gold, Gold Finger, Gold Plating, Tin Plating ,Immersion Silver, Immersion Tin, OSP |
Minimum aperture |
0.10mil/3mil |
Line width and line space |
0.10mil/3mil |
Impedance Tolerance |
±10% |
Conduction Test Impedance |
≤50Ω |
Impedance Controlling |
50 Ohm, 90 Ohm, 100 Ohm, 110 Ohm and other value |
PTH Tolerance |
0.075mm |
Minimum drilling size |
0.10mm |
Blind/Buried Vias |
Yes(HDI Technology) |
Minimum vias Pad Size |
0.3mm |
Minimum Annular Ring Size |
0.1mm |
Excessive Glue |
≤0.15 mm |
Quality Grade |
Standard IPC 2, or your need |
Build Time |
2days - 5weeks |
The rigid-flex board is a new type of printed circuit board that combines the stability of a rigid PCB and a flexible FPC. It has strong resistance to harsh application environments and a strong signal transmission path, but its manufacturing process is also more complex than normal circuit boards.