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Rigid-flex boards are flexible circuits and rigid circuits, which are combined according to relevant process requirements after lamination and other processes to form a circuit board with FPC and Rigid PCB characteristics.
The 2 layers rigid-flex board has FPC and PCB advantage at the same time. Therefore, 2 layers rigid-flex circuit can be used in some products with special requirements. 2 layers rigid-flex PCB has both a certain flexible area and a certain rigid area. 2 layers rigid-flex printed circuit board is of great help to reduce the internal space, reduce the volume of the finished product, and improve the performance of the product.
We offer rigid-flex circuit boards in a variety of features and specifications. Fast delivery is guaranteed as we offer the fastest turnaround times in the industry. Our rigid-flex circuits are durable and able to withstand harsh environments. Our Rigid-Flex Laminate Systems Available is RA Copper, HTE Copper, FR-4, Polyamide, Adhesive.
Get A QuoteThis is FR4+ polyimide rigid-flex board(that is 2Layers Rigid with 1 Flex Layer stackup), 2 layers rigid flex pcb layer down, top or bottom flex part. Usually, the flexible part is 0.1mm, and the rigid part can be 0.8-1.6mm. Our following 2 layers rigid flexible pcb thickness is 0.113mm, and the rigid circuit board is 0.765mm. Please see the bellow 2 Layers Rigid-flex circuit Stackup.
This 2 layers rigid-flex pcb (2 layers Rigid with 1 Flex Layer stackup) is a simple design with limited space and performance requirements.And have the flex layer in the middle.
Rigid-flex PCB usually consists of flexible layers and rigid parts. The flexible layer is usually composed of the following materials:
Flexible polyimide core;
conductive copper layer;
Adhesive
The conductive copper layer is sandwiched on both sides with a flexible polyimide adhesive. The polyimide layer and the adhesive layer are generally considered as one unit (called the cover layer) which can be laminated to the copper layer with heat and pressure. Multiple flex layers can be used in any given design.
The rigid part is added to the flexible layer by a rigid layer of standard PCB material:
Fiberglass prepregs are infused with resins, which flow and bond when heated;
Non-conductive fiberglass base (usually FR-4);
Traditional green solder mask;
Rigid-flex boards are flexible circuit boards and rigid circuit boards, which are combined according to relevant process requirements after lamination and other processes to form a circuit board with FPC characteristics and PCB characteristics. After manufacturedthe FPC flexible board, going through those processes to complete the production of the Rigid-flex board. Please see bellow manufacturing process.
Due to the complexity of the production process of the rigid-flex board, some of the key technical difficulties are difficult to control, which are mainly reflected in the following two points:
1.Flexible board part:
Rigid board PCB production equipment produces soft boards. Because the soft board material is soft and thin, the soft board must be passed by a traction board to avoid scrapping the board when it passes through all horizontal lines.
Lamination of PI cover film. Note that the PI cover film should be applied locally, and the fast pressure parameters should be noted. The pressure should reach 2.45MPa during fast pressing, and it should be flat and compacted during fast pressing, and there should be no problems such as air bubbles and cavities.
2.Rigid board part:
Window opening and PP of rigid board Core. The hard board adopts controlled depth milling and window opening, and the PP should use NO-FLOW PP, which can prevent excessive glue overflow during pressing.
Rigid-flex board compression expansion and contraction control. Due to the poor expansion and contraction stability of the soft board material, it is necessary to give priority to the production of the soft board and the laminated PI cover film, and make the hard board part according to its expansion and contraction coefficient.
It is precisely because the production of rigid-flex boards is more complicated than that of other printed short-circuit boards, and the yield rate of finished products is lower. Therefore, proofing verification is required before mass application and mass production of rigid-flex boards.